Destacar:
Carga máxima de montagem: |
150G |
Tipo: |
Semi -automático |
Precisão de montagem: |
±0,01 mm |
Peso: |
12kg |
Peso da máquina: |
60kg |
Tamanho do chip: |
Min 1*1 mm |
Aplicar o tamanho do chip: |
0.8*0,8~120*120mm |
Carga máxima de moagem: |
150G |
espessura aplicável do PWB: |
0,5-5 mm |
A fonte de alimentação: |
5300W |
tamanho do chip BGA: |
Max 120*120mm Min 0,8*0,8mm |
Aplicação: |
Retrabalho BGA (Ball Grid Array) |
Tamanho da placa de circuito impresso: |
Max. 470x380mm |
Componentes principais: |
CLP |
Tensão: |
220 V |
Motherboard Repair Machine WDS620 For PlayStation 5 Rapair Industrial Board
Highlight: High Precision BGA Reballing Machine, WDS 620 BGA Reballing Machine, AC 220V BGA Soldering Machine
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Power Supply:
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AC 220V±10% 50/60Hz
|
Total Power:
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5300W
|
|
Upper Heater Power:
|
Max 1200W
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Down Heater Power:
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Max 1200W
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|
IR Heater Power:
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Max 2700
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High Precision BGA Reballing Machine WDS 620 AC 220V with 5200W Power
Semi Automatic Optical Alignment BGA Rework Station WDS-620
Parameter Specification
| 1 |
Power supply |
AC 110V/220V±10％ 50/60Hz |
| 2 |
Total power |
Max 5300W |
| 3 |
Heater power |
Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W |
| 4 |
Electrical material |
Driving motor+PLC smart temp.controller+color touch screen |
| 5 |
Temperature controlling |
(high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃ |
| 6 |
Locating way |
V shape slot,PCB support jigs can adjust,laser light do fast centering and position |
| 7 |
PCB size |
Max 500*380mm Min 10*10 mm |
| 8 |
Applicable chips |
Max 80*80mm Min 1*1 mm |
| 9 |
Overall dimension |
L650×W630×H850mm |
| 10 |
Temperature Interface |
1 pcs |
| 11 |
Weight of machine |
60KG |
| 12 |
Color |
White&Blue |
Higher automatic function
Newest WDS-620 is the updated system with 5 modes.It’s Remove,Mount,Weld,Manual and Semi-auto.The mode can be changed freely.It can be used under automatic,semi-auto & manual mode.
Independent 3 heating zones temperature control system
1.The upper and lower hot air heating,which can heat up at the same time from the top of the component to the bottom of the PCB;bottom IR heating,temperature precision control within ±1℃.8 segment temperature control independently.
2.Hot air district heating for BGA and PCB at the same time,and large area IR heater preheating up for the bottom of PCB to avoid completely PCB deformation during reworking,the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.
3.Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system;4 temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved;temperature can be tested precisely through external measurement interface,curves can be analysed,set and correct on the touch screen at any time.
Precision optical alignment system
Using HD and adjustable CCD color optical alignment system,beam split,amplification,lessening,fine adjustment and auto focus with the function that automatic color aberration resolution and brightness adjustment,adjustable image contrast;equipped with 15 ” high definition LCD monitor.
Multi-functional and humanized operation system
1.Adopting the HD touch human-machine interface;upper heating head and mounting head designed 2 in 1;providing many kinds of titanium alloy BGA tuyere can be rotated in 360 degree for easy installation and replacement.
2.X,Y and R angle adopted micrometer fine-tuning,accuracy locating,precision can reach ±0.01mm.
Superior safety protection function
With the alarm function, after the BGA welding the machine can alarm by itself.In the case of temperature abuse, the circuit can power off automatically with the double over-temperature protection.Temperature parameter having password protection to prevent any modification.
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